Please use this identifier to cite or link to this item:
192.168.6.56/handle/123456789/36075| Title: | Woodhead Publishing Series in Electronic and Optical Materials: Number 81 Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture |
| Authors: | Wong, E.-H. Mai, Y.-W. |
| Keywords: | Against Mechanical Shock, |
| Issue Date: | 2015 |
| Publisher: | Elsevier Ltd. All rights reserved |
| URI: | http://10.6.20.12:80/handle/123456789/36075 |
| ISBN: | 978-1-84569-528-6 458 |
| Appears in Collections: | Electrical and Computer Engineering |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.