Please use this identifier to cite or link to this item: 192.168.6.56/handle/123456789/32239
Title: Modelling and Simulation in Thermal and Chemical Engineering A Bond Graph Approach
Authors: Thoma· B, J
Keywords: Chemical Engineering
Issue Date: 2008
Publisher: Springer-Verlag Berlin Heidelberg
URI: http://10.6.20.12:80/handle/123456789/32239
ISBN: 978-3-642-08566-6
228
Appears in Collections:Electrical and Computer Engineering

Files in This Item:
File Description SizeFormat 
74.pdf6.78 MBAdobe PDFView/Open
Show full item record


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.